Important note: sign-up for ELECTRICAL & ELECTRONIC ENGINEERING (ET), APPLIED COMPUTER SCIENCE (TI), MECHATRONICS (MT) and APPLIED PHYSICS (TN) students use Bisoncode: L.26183
Important note: sign-up for MECHANICAL ENGINEERING (WTB) students use Bisoncode: L.26658

* The client of this project will attend the Preview on Thursday 28th of November from 13:30 to 16:00 at Saxion Enschede (Ariënsplein 1).

Here, your 3S group will work on the reliable electronic readout and the reliable assembly of various MEMS (Micro-Electro Mechanical System) sensors, like for example: accelerometers, microfluidic devices, pressure sensors etc. The challenge in this new project is twofold: a) find efficient ways to test mechanical/fluidic/optic sensors only using electronic signals and b) find manufacturable paths for solder-less assembly of such devices in a complete system. You will focus on one of these challenges, depending on the intake meeting with the members of the Research Chair Nanophysics and your interests at the start of the project. If the group is big enough, we can also split in two assignments. 

Our partners are The Netherlands Space Research  Organisation (SRON), Salland Engineering and Sensata Technologies. The work is carried out in our labs at the High Tech Factory at the University of Twente campus.

A previous 3S group already did this project so you can build on their work. There is however much freedom to choose the direction: you can either focus on the physical design of reliable components, the operation of the manufacturing systems on our lab or the electronic readout of MEMS devices.

Our partners, The Netherlands Space Research Organisation (SRON), Salland Engineering and Sensata are teaming up together with the Research Chair NanoPhysics Interfaces @ the Saxion to investigate, on a long-term basis, how can MEMS and NEMS devices be designed, tested and assembled in a reliable but cost-effective way. We will look into all aspects of the Smart Industry revolution (3D printing, configurable electronics, new production techniques) as well as use the extensive expertise of SRON to enable new techniques and methods for the readout and assembly of novel sensor devices for the two industrial partners. 

A previous group already started working on this project so you can build on their expertise. They focused on finding manufacturable paths to solder-less assembly of a automotive pressure sensor that will improve reliability and the sustainability of the product. The work they did covered a few areas: a) thermal shock-related simulations of the flex-pcb holding the sensor, b) new ways to design the flex-pcb so that thermal stresses are less and c) design and operation of a micro-motion station in our labs at the High Tech Factory for accurate dispensing of alternatives to solder as well as optical inpection. 

We look for electronic engineering students, applied computer science students as well as mechatronics and physics students. There will be a concrete case presented in front of you, most likely an assignment in our microassembly and/or MEMS test labs at the High-Tech-Factory at the Campus of the University of Twente. Regular trips and contact with SRON, Salland and Sensata will be part of your work. 

Required study programs:

Electrical & Electronic Engineering (ET):

  • Development of control interfaces front-and backend, some in real-time, for our custom measurement and micro-motion equipment in the HTF based on python, C# or C++
  • Board-level design and test of microsensor arrays
  • Motion/Motor feedback & control for positioning with microprecision

Applied Computer Science (TI):

  • Development of control interfaces front-and backend, some in real-time, for our custom measurement and micro-motion equipment in the HTF based on python, C# or C++
  • Implementation of image processing algorithms on embedded platforms

Applied Physics (TN):

  • Image processing algorithms and/or vision optics design for detecting nanometric motion of MEMS moving parts
  • Simulations in COMSOL of temperature shocks of microsensor assemblies, idea generation and mechanical design of components that survive T-shock
  • Simulations in COMSOL of MEMS and microflow devices for the purposes of optimal electronic/mechanical coupling and probing
  • Microdroplet dispensing/writing with microprecision

Mechanical Engineering (WTB):

  • Design of parts and assemblies for our custom measurement and micro-motion equipment in the HTF based on python, C# or C++
  • Motion/Motor feedback & control for positioning with microprecision
  • Idea generation and mechanical design of components that survive T-shock

Mechatronics (MT):

  • Image processing algorithms and/or vision optics design for detecting nanometric motion of MEMS moving parts
  • Motion/Motor feedback & control for positioning with microprecision
  • idea generation and mechanical design of components that survive T-shock

Location: Enschede, High Tech Factory at the UT campus.

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Questions about this project?

Feel free to contact us if you have any questions about this project. You can call us at 088 - 019 53 11 or use the form below. We wil get back to you within two business days.